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| CMP is a manufacturing broker for ICs and MEMS, for prototyping and low volume production. Since 1981, more than 1000 Institutions from 66 countries have been served, more than 5200 projects have been prototyped through 600 manufacturing runs, and more than 60different technologies have been interfaced. Integrated Circuits are available on SOI 65nm, CMOS down to 45 nm, SiGe:C BiCMOS (.25 µ), CMOS-Opto (.35 µ), MMIC GaAs (HEMT .2 µ). ARM IP cores are available on .12 µ and 65 nm CMOS. MEMS are available on various processes: compatible front-side bulk micromachining (GaAs), monolithic integration with standard CMOS processes (ASIMPS from MEMSCAP), specific MEMS technologies (PolyMUMPS, SOIMUMPS, MetalMUMPS from MEMSCAP, SUMMIT from SANDIA). Design kits for most IC CAD tools and Engineering kits for MEMS are available. Assembling is provided in a wide range of plastic and ceramic packages. CAD software (tools for PCs, ARM suite of tools, ...) are also proposed. Further information on CMP can be found at: http://cmp.imag.fr |