Plenary Session II
Kris Verma, ISQED Plenary Committee Chair
Res Saleh, ISQED Conference Chair
2P.1 The Role of ICs in the Creation of a Connected World and the importance of Product Quality
Chairman and CEO, Raza Foundries Inc.
Human Beings being social have had a need to communicate. The modern chapter in enabling large scale communication has been aided by intelligence in the transport, distribution, protection, traffic management, decoding, analyzing and displaying of communication content. The intelligence has been embedded in an explosive confluence of Software, Systems and Integrated Circuits. This has resulted in the most amazing transformation of the way we live our lives, work, and engage in all other necessary and capricious activity. It has also created a huge economic footprint on the Gross Domestic Product of the United States of America. With a massive transformation that has occurred in such a short time, this throbbing network across the planet has to operate reliably because of the precious payload it carries.
Wireless Systems-on-a-Chip Design
is a fundamental shift that is occurring in the implementation of
2P.3 Microwave III-V Semiconductors for Telecommunications and Prospective of the III-V Industry
President and CEO, WIN Semiconductors
The Microwave III-V semiconductor IC technology (Primarily GaAs) has emerged as a powerful, enabling, technology for the wireless and optical communications in the past 5 years. It has been dominating, or making substantial penetration into, the market for handset power amplifiers and switches, advanced wireless LAN RF front-ends and various other key RF components for broadband wireless, wireless infrastructure, satellite telecommunications, high data rate fiber optical communications and automotive radar applications. The Microwave III-V semiconductor IC industry has grown dramatically in the past 2-3 years. It is worth noting that the majority of the recently formed GaAs Fabs are located in Taiwan. Their intent is to provide pure-play foundry services following the silicon foundry business model developed by TSMC and UMC. In this presentation, we will discuss the key components of III-V microwave transistors (HBT, pHEMT and MESFET etc.) and their RFICs/MMICs, their electrical performance, major applications, market status, trends and opportunities. We will define the current status for the global III-V semiconductors industry, the rapidly growing GaAs MMIC Fab industry in Taiwan and its advantages for providing a one-stop, total solution for the wireless and optical communication components customers.
2P.4 Tomorrows High-quality SoCs Require High-quality Embedded Memories Today
Senior Director, Infineon Technologies AG
memories increasingly dominate SoC designs - whether chip area, performance,
power consumption, manufacturing yield or design time are considered. ITRS data
indicate that the embedded memory contents of ICs may increase from 20% in 1999
to 90% at the 50nm node by the end of the decade. Therefore, even more than
today, the success of tomorrow's SoC design will depend on the availability of
high-quality embedded memories.
for Quality Electronic Design (ISQED Org.)