Session 3B

3:30pm - 5:30pm

 

Impact of New Standards for Design Data Modeling and Manufacturing Interface

 

Co-Chairs

Andrew Kahng, University of California, San Diego

Tom Chen, Colorado State University

3:30pm

Introduction

 

3:35pm

3B-1            Assessment of the Open Access Standard: Insights on the New EDA Industry Standard From Hewlett Packard, an Early Beta Partner and Contributing Development (Invited), Terry Blanchard, Hewlett Packard          

 

4:05pm

3B-2    Impact of Interoperability on CAD-IP Reuse (Invited), Igor Markov, University of Michigan         

 

4:35pm

3B-3            Interoperability Beyond Design: Sharing Knowledge Between Design and Manufacturing (Invited), Don Cottrell, Si2     

 

 


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