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Session 2B
1:00pm - 3:05pm
Package design and interaction
Co-Chairs
Ravi
Mahajan, Intel
Erwin Cohen, IBM
1:00pm
Introduction
1:05pm
2B-1
Design Tools for Packaging (Invited)
Lalitha Immaneni, Anju Kapur,
Brett Neal
1:35pm
2B-2
Robustness Enhancement through Chip-Package Co-design for High-Speed Electronics
Meigen shen, Li-Rong Zheng, Hannu
Tenhunen
2:05pm
2B-3
Flip Chip Advanced Package Solder Joint Embrittlement Fault Isolation Using TDR
Roderick
Cruz
2:35pm
2B-4
Clap: A Clustering Based Area I/O Planning For Flip-Chip Technology
Jai Ganesh kumar, Kishore Kumar Muchherla, Janet Wang
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