Session 2B

1:00pm - 3:05pm

 

Package design and interaction

 

Co-Chairs

Ravi Mahajan, Intel
Erwin Cohen,
IBM

 

1:00pm

Introduction

 

1:05pm

2B-1    Design Tools for Packaging (Invited)
Lalitha Immaneni, Anju Kapur, Brett Neal

 

1:35pm

2B-2            Robustness Enhancement through Chip-Package Co-design for High-Speed Electronics
Meigen shen, Li-Rong Zheng, Hannu Tenhunen

 

2:05pm

2B-3    Flip Chip Advanced Package Solder Joint Embrittlement Fault Isolation Using TDR
Roderick Cruz

 

2:35pm

2B-4            Clap: A Clustering Based Area I/O Planning For Flip-Chip Technology
Jai Ganesh kumar, Kishore Kumar Muchherla, Janet Wang


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