Session 3A

3:30pm - 5:30pm

 

Modeling and simulations of Electromigration and Eletromagnetic Effect

 

Co-Chairs

Tom Chen, Col State - Ft. Collins
James Lei, Altera

 

3:30pm

Introduction

   

3:35pm

3A-1    Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect
Valeriy Sukharev
 

 

4:05pm

3A-2    Circuit Level Reliability Analysis of Cu Interconnects
Syed M. Alam, Gan Chee Lip, Carl V. Thompson, and Donald E. Troxel
     

 

4:35pm

3A-3            A Methodology for Chip-Level Electromigration Risk Assessment and Product Qualification
Chanhee Oh, Haldun Haznedar, Vladimir Zolotov, Martin Gall, Amir Grinshpon, Pon Ku, Rajendran Panda

 

4:50pm

3A-4            Modeling and simulation of circuit-electromagnetic effects in electronic design flow
Pavel Nikitin, Vikram Jandhyala, Daniel White, Nathan Champagne, John D. Rockway, Richard Shi, Chuanyi Yang, Gong Ouyang, Yong Wang, Rob Sharpe, John W. Rockway
Home| Conference| Committee| Sponsors| Resources| Archive| News

International Society for Quality Electronic Design (ISQED Org.)
Copyright © 1998-2004 ISQED. All rights reserved.
Revised: February 08, 2004