International Symposium on Quality Electronic Design (ISQED)
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ISQED'14 China Call for Papers

Please note the following important dates:

FINAL Paper Submission Deadline
Full Length paper
July 21, 2014
Acceptance Notification Aug 18, 2014
Camera-Ready Paper Due Sept 18, 2014
Conference Oct. 27-29, 2014


ISQED strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design and intends to highlight and accelerate cooperation among the IC design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities. ISQED-China’14 starts with Tutorials on Monday Oct. 27 and then spans two days, in several parallel tracks, hosting many technical presentations, several keynote speakers, other informal meetings. All past conference proceedings have been published by IEEE and posted in the IEEE digital library and indexed by Scopus.

Papers are requested in the following areas

As a premier Asia Symposium, ISQED accepts and promotes papers related to circuit and system design (digital, analog, RF, and mixed-signal), semiconductor manufacturing, advanced IC Packaging, Test, Electronic Design Automation (EDA), as well as emerging semiconductor nano/bio-technologies, and photovoltaic electronics. Topics of interest for paper submission are as follows:


IC and System-level Design & Test System-level Design, Methodologies & Tools

    • Analog, Digital, Mixed-Signal and RFIC Design
    • FPGA Architecture, Design, and CAD
    • Robust & Power-conscious Circuits & Systems
    • Design of Reliable & Fault Tolerant Circuits and Systems
    • Design of Embedded Systems

IP Design, Quality, Interoperability and Reuse

    • Design Verification and Design for Testability
    • Physical Design, Methodologies & Tools
    • EDA Methodologies, Tools, Flows

Semiconductor Materials, Process and Devices Emerging/Innovative

    • Process & Device Technologies
    • Yield and Reliability Analysis, Prediction, and Management

Advanced IC Packaging, 3D ICs IC Package - Design Interactions & Co-Design

    • Advanced 3D ICs & 3D Packaging
    • High density PCB/PWB
    • Signal and Power Integrity

Sensors Technology, Design and Applications, MEMS/NEMS

Mobile Internet and Internet of Things: Technology, Design and Applications

Antennas Technology, Design and Applications, Wireless Power Transfer


Submission of Papers

Paper submission must be done on-line through the conference web site at The guidelines for the final paper format are provided on the symposium website. Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 10 pages) along with abstract of about 200 words. Please check the as-printed appearance of your paper before sending your paper. In case of any problems, email info @

Resources for Authors