ISQED'14 China Technical Program Committee
Gaofeng Wang, Hangzhou Dianzi University (Chair)
Paul Franzon, North Carolina State University (Co-Chair)
Smart Sensors Design and Technology, IoT (SSDT)
Zhenghong Qian, Hangzhou Dianzi University (Chair)
Bin Wang, Hangzhou Dianzi University (Co-Chair)
Committee Members:
Soroush Abbaspour - IBM Research
Danilo Demarchi - Politecnico di Torino
Ahmed Eltawil - University of California, Irvine
Vittorio Ferrari - University degli Studi di Brescia
Matthew Law - University of Macau
Chi-Un Lei - University of Hong Kong
James Lei - Applied Harmonics Corp
Deshi Li - Wuhan University
Hui Li - Intel
Ye Liu - Oracle Corporation
Hisayo S. Momose - Toshiba Corporation
Kash Ng - NA
V. Ramgopal Rao - IIT Bombay
Libor Rufer - University of Grenoble / TIMA Laboratory
Thilo Sauter - Danube University Krems
Vandy Wang - The Hong Kong University of Science and Technology
Libo Zeng - Wuhan University
Xuefeng Zeng - Globalfoundries US Inc.
Geng Zheng - University of North Texas
System-level Design and Methodologies (SDM)
Michael Huebner, Ruhr-University (Chair)
Committee Members:
Abbes Amira - University of the West of Scotland, UK
Rajesh Berigei - Texas Instruments Inc.
Koustav Bhattacharya - Intel Corporation
Yu Cai - LSI Corporation
Deming Chen - University of Illinois, Urbana-Champaign
Qinghua Chen - Yangtze Delta Region Institute of Tsinghua Univ
Eui-Young Chung - Yonsei University
Alberto Del Barrio Garcia - Complutense University of Madrid
Oğuz Ergin - TOBB University of Economics and Technology
Fabiano Hessel - PUCRS
Chih-Tsun Huang - National Tsing Hua University, Taiwan
Reyhaneh Jabbarvand Behrouz - George Mason University
Mohammad Khavari Tavana - George Mason University
Seung-Eun Lee - Seoul National University of Science and Technology
Duo Liu - Chongqing University
Farhad Mehdipour - E-JUST Center, Kyushu University
Antonio Nunez - IUMA/University Las Palmas GC
Qinru Qiu - Syracuse University
Shanq-Jang Ruan - National Taiwan University of Sci. and Tech.
Ashraf Salem - Mentor Graphics
Chung-An Shen - National Taiwan University of Science and Technology
Jay Sivagnaname - Freescale Semiconductor
Klaus Waldschmidt - Technische Informatik an der Universität Frankfurt
Bin Wu - Qualcomm Inc.
Teong Guan Yew - Intel Corporation
Package and Three-Dimensional Integration (PTDI)
Farhang Yazdani, BroadPak Corporation, USA (Chair)
Wenyan Yin, Zhejiang University (Co-Chair)
Committee Members:
Ibrahim Ahmad - Universiti Tenaga Nasional
Yuuki Araga - Advanced Industrial Science and Technology (AIST), Japan
Bok Eng Cheah - Intel Corporation
Guoqing Chen - AMD
Richard Crisp - Etron Technology
Houle Gan - Intel
Minghui Han - Samsung
Johnny C. Ho - City University of Hong Kong
Nauman Khan - Intel Corporation
SoYoung Kim - SungKyunKwan University
Eren Kursun - IBM Research
Yong Liu - Fairchild Semiconductor
Pol Marchal - IMEC, Belgium
Vasilis Pavlidis - University of Manchester
Xiaoning Qi - Intel
Emre Salman - Stony Brook University
Weiping Shi - Texas A&M University
Yiyu Shi - Missouri University of Science and Technology
Jianyong Xie - Intel Corporation
Cindy-Yang Yi - University of Missouri – Kansas City
Payman Zarkesh-Ha - University of New Mexico
Integrated Circuit Design (ICD)
TBA (Chair)
Committee Members:
Ali Afzali-Kusha - University of Tehran
Chip Hong CHANG - Nanyang Technological University
Subho Chattejee - Intel Custom Foundry.
Zhiqun Cheng - Hangzhou Dianzi Univ
Marshnil Dave - Marvell Semiconductors
Rajesh Garg - Intel
Abhilash Goyal - Oracle
Stephen Heinrich-Barna - Texas Instruments, Inc
Ed Ho - Qualcomm
Qijun Huang - Wuhan University
Rouwaida Kanj - American University of Beirut
Amin Khajeh - Intel Labs
Tony T. Kim - Nanyang Technological University
Hai Li - University of Pittsburgh
Choon Hou Lock - Intel
Pascal Meinerzhagen - EPFL, currently also BIU
Kash Ng - NA
Sang Phill Park - Sr. Graphics HW Engineer
Kurt Schwartz - Texas Instruments
Radu Secareanu - Freescale
Maryam Shojaei Baghini - IIT-Bombay
Jawar Singh - Indian Institute of Information Technology, Design and Manufacturing, Jabalpur, India
Haibo Wang - Southern Illinois University
Lei Wang - University of Connecticut
Yong Wang - Shangdong Univ
Zhigong Wang - Southeast Univ
JiangChao Wu - University of Macau
Zushu Yan - University of Macau
Yintang Yang - Xidian Univ
Jun Yin - University of Macau
Yongsheng Yin - Hefei University of Technology
Chuan Zhang - Southeast University
Jingyi Zhang - Broadcom
Yaohua Zhao - University of Macau
EDA,IP Cores; Interop, Security, and Reuse (EDA)
James Lei, Applied Harmonics Corp (Chair)
Bao Liu, University of Texas at San Antonio (Co-Chair)
Andre Reis, UFRGS (Co-Chair)
Committee Members:
Swarup Bhunia - Case Western Reserve University
Shir-Shen Chang - Synopsys
Swaroop Ghosh - University of South Florida
Chien-Nan Liu - National Central University
Alexander Mitev - Aries Design Automation
Ahmed Shebaita - Synopsys
Guo Yu - Oracle Corporation
Min Zhao - Oracle Corportation
Cheng Zhuo - Intel
Design Verification and Design for Test (DVFT)
Miroslav Velev, Aries Design Automation (Chair)
Committee Members:
Jin-Ho Ahn - Hoseo University
George Alexiou - University of Patras
Chin Hai Ang - Altera Corporation Sdn Bhd
Sanghyun Baeg - Hanyang University
Sudarshan Bahukudumbi - Intel Corporation
Ateet Bhalla - Oriental Institute of Science & Technology, Bhopal, India.
Sreejit Chakravarty - LSI Logic
Abhijit Chatterjee - Georgia Institute of Technology
Serge Demidenko - Massey University
Narendra Devta Prasanna - LSI Logic
Mohana Asha Latha Dubasi - North Dakota State University
Masahiro Fujita - University of Tokyo
Patrick Girard - LIRMM
Yanxiang He - Wuhan Univ
Michael Hsiao - Virginia Tech
Jiun-Lang Huang - National Taiwan University
Sungho Kang - Yonsei University
Moiz Khan - Synopsys
Jin-Fu Li - National Central University
Abadir Magdy - Freescale Semiconductor
Sungju Park - Hanyang University
Spyros Tragoudas - Southern Illinois University
Yiorgos Tsiatouhas - University of Ioannina
Raimund Ubar - Tallinn University of Technology
Vinod Viswanath - Real Intent
Physical Design, Methodologies & Tools (PDM)
Aida Todri-Sanial, LIRMM (Chair)
Committee Members:
Boon-Chong Ang - eASIC
Senthil Arasu - Broadcom
Kevin Brelsford - Synopsys
Shih-Hung Chen - IMEC
Shih-Hsu Huang - Chung Yuan Christian University
Hsien-Hsin S. Lee - Georgia Tech / TSMC
Yu-Min Lee - National Chiao Tung University
Yuchun Ma - Tsinghua University
Renato Ribas - UFRGS
Jia Wang - Illinois Institute of Technology
Hua Xiang - IBM
Hu Xu - NVIDIA Corporation
Emerging Process & Device Technologies (EDT)
Jawar Singh, Indian Institute of Information Technology, Design and Manufacturing, Jabalpur, India (Chair)
Hua-Qiang Wu, Tsinghua University (Co-Chair)
Committee Members:
Yiran Chen - University of Pittsburgh
Jin He - Peking University
Lili He - San Jose State University
Pankaj Kalra - SanDisk
Nikos Konofaos - Aristotle University of Thessaloniki
Yiming Li - National Chiao Tung University
Yan Luo - Oracle Inc.
Jimson Mathew - University of Bristol
Saraju Mohanty - University of North Texas
Arthur Nieuwoudt - Synopsys
Tahui Wang - National Chiao Tung University, Taiwan
Xiaodong (Eric) Yang - Global Foundries
Zhiping Yu - Tsinghua University
Design for Manufacturability/Yield & Quality (DFQ)
Xuan Zeng, Fudan Univ (Chair)
Committee Members:
Ibrahim Ahmad - Universiti Tenaga Nasional
Pavan Bashaboina - Globalfoundries US Inc.
Rajan Beera - Pall Corporation
Paulo Butzen - Universidade Federal do Rio Grande - FURG
Y. H. Cheng - Peking University
Abishai Daniel - Intel Corp
Eric Foreman - IBM
Amlan Ghosh - AMD
Hidetoshi Matsuoka - Fujitsu Laboratories Ltd
Rajendra Patrikar - NA
Fedor Pikus - Mentor Graphics
Takashi Sato - Kyoto University
Ehrenfried Zschech - Fraunhofer IKTS Dresden
Antennas Technology, Design and Applications (ANT)
Bing-Zhong Wang, University of Electronic Science and Technology of China (Chair)
Rushan Chen, Nanjing University of Science and Technology (NUST) (Co-Chair)
Committee Members:
Lixin Guo - Xidian Univ
Yong-Xin Guo - National University of Singapore
Srini Krishnamoorthy - Advanced Micro Devices
Haiwen Liu - NA
Guoqing Luo - Hangzhou Dianzi University
Yueping Zhang - Nanyang Technological University