40nm ultra-low leakage SRAM at 170 deg.C operation for embedded flash MCU

Yoshisato Yokoyama,  Yuichiro Ishii,  Hidemitsu Kojima,  Atsushi Miyanishi,  Yoshiki Tsujihashi,  Shinobu Asayama,  Kazutoshi Shiba,  Koji Tanaka,  Tatsuya Fukuda,  Koji Nii,  Kazumasa Yanagisawa
Renesas Electronics Corporation


Abstract

An 160Kb SRAM macro with ultra-low leakage Deep Standby mode is fabricated in 40nm embedded Flash process with newly developed 0.394um2 memory-cell, which can operate up to 170deg.C for automotive application. Raising source of pull-down memory-cell MOS and floated digit lines leads to drastic reduction of memory-cell leakage, and separating memory-cell power line from peripheral one enables complete cutoff of peripheral leakage. The leakage power is 1.86uW/Mbits at 25deg.C. As a result, standby leakage of total 11.1 Mbits embedded SRAM in the MCU can be cut 88% at 170deg.C.