A Novel Physical Failure Analysis of MEMS Motion Sensor for Interface Inspection

Chunan Huang1,  Li Chuang1,  Kim Hsu1,  Steel Chung2,  Tim Chan2
1Integrated Service Technology, 2Richtek Technology


This paper demonstrates a novel physical failure analysis (PFA) solution of MEMS motion sensor to inspect the fusion bonding interface between MEMS motion sensor proof-mass and oxide layer to locate defect points. This analytical study shows successful etching solution removal of MEMS motion sensor proof-mass and inspection of defect points.