Embedded Integrated Microdevices for the Internet of Things

Mark Bachman
University of California, Irvine


Recent interest in the Internet of Things (IoT) has created strong demand for embedded sensors and actuators that are highly integrated and low cost. Many transducing devices today are made from micro-electromechanical systems (MEMS), which are typically manufactured using silicon micromachining. Such devices must then be packaged and integrated elsewhere to produce modules that have value for IoT. However, post-semiconductor manufacturing processes (PSM), including packaging and printed circuit board (PCB) technologies, can be used to manufacture MEMS for sensing and actuation applications. Recent advancements in packaging technology, particularly for system-in-package applications, have produced processes that can produce feature sizes small enough to be used for building microsystems. Furthermore, such devices can be built with a high degree of integration, pre-packaged, and at low cost. Indeed, the PCB and packaging industries stand to benefit greatly by expanding their offerings beyond servicing the semiconductor industry and developing their own devices and products.