Micro-transfer printing (µTP) enables heterogeneous integration of different semiconductor technologies, offering high flexibility for next-generation electronic systems. However, transitioning µTP from research demonstrations to mass production requires systematic design methodologies that address unique fabrication constraints absent in conventional integrated circuit (IC) design flows. Unlike traditional chip design, µTP introduces interrelated design decisions that span die-level layout, wafer-level planning, and packaging considerations, requiring specialized approaches and tools. This paper presents a comprehensive design methodology for µTP-based heterogeneous integration. Our methodology covers the entire design flow from initial wafer planning to layout implementation, explicitly considering the process constraints of µTP. Supported by a representative design example, this work offers chip and packaging designers a practical introduction to manufacturable µTP design, substantially minimizing the need for iterative refinement.